BSC027N04LSGATMA1 Infineon Technologies IC REG LINEAR 1.8V 500MA 6WSON

label:
04/11/2025 23
BSC027N04LSGATMA1 Infineon Technologies  IC REG LINEAR 1.8V 500MA 6WSON


• FastswitchingMOSFETforSMPS
• OptimizedtechnologyforDC/DCconverters
• QualifiedaccordingtoJEDEC1)fortargetapplications
• N-channel;Logiclevel
• ExcellentgatechargexRDS(on)product(FOM)
• Verylowon-resistanceRDS(on)
• 100%Avalanchetested


CATALOG
BSC027N04LSGATMA1 COUNTRY OF ORIGIN
BSC027N04LSGATMA1 PARAMETRIC INFO
BSC027N04LSGATMA1 PACKAGE INFO
BSC027N04LSGATMA1 MANUFACTURING INFO
BSC027N04LSGATMA1 PACKAGING INFO
BSC027N04LSGATMA1 ECAD MODELS


COUNTRY OF ORIGIN
China
Malaysia


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single Quad Drain Triple Source
Maximum Drain Source Voltage (V) 40
Maximum Continuous Drain Current (A) 24
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 2.7@10V
Typical Gate Charge @ Vgs (nC) 31@4.5V|64@10V
Operating Junction Temperature (°C) -55 to 150
Typical Gate Charge @ 10V (nC) 64
Maximum Power Dissipation (mW) 2500
Process Technology OptiMOS
Category Power MOSFET
Maximum Junction Case Thermal Resistance (°C/W) 1.5°C/W
Typical Input Capacitance @ Vds (pF) 5100@20V
Maximum Pulsed Drain Current @ TC=25°C (A) 400
Typical Turn-On Delay Time (ns) 9.8
Typical Turn-Off Delay Time (ns) 39
Typical Fall Time (ns) 6.2
Typical Rise Time (ns) 5.6
Maximum Gate Threshold Voltage (V) 2
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package TDSON EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5.15
Package Width (mm) 5.9
Package Height (mm) 1
Package Diameter (mm) N/R
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Material Plastic
Package Family Name SON
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 5000


ECAD MODELS
製品 RFQ