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• The LM53603-Q1, LM53602-Q1 are available as
AEC-Q1-Qualified Automotive Grade Products
With Following Results:
– Device Temperature Grade 1: -40°C to +125°C
Ambient Operating Range
– Device HBM ESD Classification Level 1C
– Device CDM ESD Classification Level C4B |
• 3 A or 2 A maximum load current |
• Input Voltage Range from 3.5 V to 36 V:
Transients to 42 V |
• Output Voltage Options: 5 V, 3.3 V, ADJ |
• 2.1 MHz Fixed Switching Frequency |
• ±2% Output Voltage Tolerance |
• –40°C to 150°C Junction Temperature Range
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• 1.7 µA Shutdown Current (typical) |
• 24 µA Input Supply Current at No Load (typical)
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• No external Feed-back Divider Required for 5 V or
3.3 V output |
• Reset Output With Filter and Delay |
• Automatic Light Load Mode for Improved
Efficiency |
• User-Selectable Forced PWM mode (FPWM) |
• Built-in Loop Compensation, Soft-start, Current
Limit, Thermal Shutdown, UVLO, and External
Frequency Synchronization |
• Thermally Enhanced 16-lead Package:
5 mm x 4.4 mm x 1 mm
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CATALOG |
LM53602AQPWPRQ1 COUNTRY OF ORIGIN |
LM53602AQPWPRQ1 PARAMETRIC INFO |
LM53602AQPWPRQ1 PACKAGE INFO |
LM53602AQPWPRQ1 MANUFACTURING INFO |
LM53602AQPWPRQ1 PACKAGING INFO |
LM53602AQPWPRQ1 ECAD MODELS |
LM53602AQPWPRQ1 FUNCTIONAL BLOCK DIAGRAM |
LM53602AQPWPRQ1 APPLICATIONS |
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
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PARAMETRIC INFO |
Type |
Synchronous Step Down |
Number of Outputs |
1 |
Minimum Input Voltage (V) |
3.9 |
Maximum Input Voltage (V) |
36 |
Output Voltage (V) |
5|3.3|3.3 to 6 |
Maximum Output Current (A) |
2 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Supplier Temperature Grade |
Automotive |
Switching Frequency (kHz) |
2350 |
Switching Regulator |
Yes |
Operating Supply Voltage (V) |
3.9 to 36 |
Output Type |
Adjustable|Fixed |
Load Regulation |
77mV(Typ) |
Line Regulation |
7mV(Typ) |
Typical Quiescent Current (uA) |
8 |
Minimum Storage Temperature (°C) |
-40 |
Maximum Storage Temperature (°C) |
150 |
Typical Switch Current (A) |
4.4(Max) |
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PACKAGE INFO |
Supplier Package |
HTSSOP EP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
16 |
Lead Shape |
Gull-wing |
PCB |
16 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
5.1(Max) |
Package Width (mm) |
4.5(Max) |
Package Height (mm) |
1.05(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5.1(Max) |
Package Overall Width (mm) |
6.6(Max) |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
Package Family Name |
SO |
Jedec |
N/A |
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MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Navigation/GPS |
• Instrument Cluster |
• ADAS, Infotainment, HUD |
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