|
|
• Low Offset Voltage: ±5 µV
|
• Low Offset Voltage Drift: ±0.2 µV/°C
|
• Low Noise: 5.5 nV/√Hz at 1 kHz
|
• High Common-Mode Rejection: 140 dB
|
• Low Bias Current: ±5 pA
|
• Rail-to-Rail Input and Output
|
• Wide Bandwidth: 10 MHz GBW
|
• High Slew Rate: 20 V/µs
|
• Low Quiescent Current: 1 mA per Amplifier
|
|
| CATALOG |
OPA2192IDGKR COUNTRY OF ORIGIN
|
OPA2192IDGKR PARAMETRIC INFO
|
OPA2192IDGKR PACKAGE INFO
|
OPA2192IDGKR MANUFACTURING INFO
|
OPA2192IDGKR PACKAGING INFO
|
OPA2192IDGKR ECAD MODELS
|
OPA2192IDGKR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
Thailand
|
United States of America
|
|
PARAMETRIC INFO
|
| Manufacturer Type |
Precision Amplifier |
| Type |
Precision Amplifier |
| Rail to Rail |
Rail to Rail Input/Output |
| Minimum Single Supply Voltage (V) |
4.5 |
| Number of Channels per Chip |
2 |
| Minimum PSRR (dB) |
130.45(Typ) |
| Typical Single Supply Voltage (V) |
5|9|12|15|18|24|28 |
| Maximum Single Supply Voltage (V) |
36 |
| Maximum Quiescent Current (mA) |
2.4@36V |
| Minimum Dual Supply Voltage (V) |
±2.25 |
| Typical Gain Bandwidth Product (MHz) |
10 |
| Maximum Input Offset Voltage (mV) |
0.04@36V |
| Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15 |
| Maximum Input Offset Current (uA) |
0.00002@36V |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Operating Supply Voltage (V) |
±18|36 |
| Maximum Input Bias Current (uA) |
0.00002@36V |
| Minimum CMRR (dB) |
100 |
| Maximum Supply Voltage Range (V) |
36 to 37 |
| Minimum CMRR Range (dB) |
95 to 105 |
| Typical Voltage Gain (dB) |
140 |
| Typical Slew Rate (V/us) |
20@36V |
| Typical Settling Time (ns) |
2100 |
| Typical Output Current (mA) |
65 |
| Typical Input Noise Voltage Density (nV/rtHz) |
32@36V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.0015@36V |
| Typical Input Bias Current (uA) |
0.000005@36V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single|Dual |
| Input Offset Voltage Drift (uV/°C) |
1 |
|
|
PACKAGE INFO
|
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Multiplexed Data-Acquisition Systems
|
| • Test and Measurement Equipment |
| • High-Resolution ADC Driver Amplifiers |
• SAR ADC Reference Buffers
|
• Programmable Logic Controllers
|
| • High-Side and Low-Side Current Sensing
|
| • High Precision Comparator |
| |
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